Call For Papers
The organizing committee of conference is pleased to invite prospective authors to submit
their original manuscripts to 10 th ICMSSM 2025.
Authors are invited to submit papers (up to 9 pages for technical content including figures and references, and references). Submission instructions, templates for paper format please refer to the footer of the website, and the “no show*” policy are available at this page. All accepted papers will be published in electronic formal proceedings - with ISBN number, and to be indexed in the major bibliographical search engines...
ICMSSM 2025 is planned to be an hybrid event. Please refer to the ICMSSM website for updates and details. At least one author will be required to register and attend the conference onsite or online. Failure to present at the conference may result in the removal of the submission from conference proceedings.
*Non-Presented Paper (No-Show) Policy: Any accepted paper included in the final program is expected to have at least one author or qualified proxy attend and present the paper at the conference. If a paper is not presented at the conference, the paper will not be published formal proceedings.
The topics of 10th ICMSSM 2025 cover Mechanical Structures and Smart Materials Related Issue, etc.
Topics of interest for submission include, but are not limited to:
Authors are invited to submit papers (up to 9 pages for technical content including figures and references, and references). Submission instructions, templates for paper format please refer to the footer of the website, and the “no show*” policy are available at this page. All accepted papers will be published in electronic formal proceedings - with ISBN number, and to be indexed in the major bibliographical search engines...
ICMSSM 2025 is planned to be an hybrid event. Please refer to the ICMSSM website for updates and details. At least one author will be required to register and attend the conference onsite or online. Failure to present at the conference may result in the removal of the submission from conference proceedings.
*Non-Presented Paper (No-Show) Policy: Any accepted paper included in the final program is expected to have at least one author or qualified proxy attend and present the paper at the conference. If a paper is not presented at the conference, the paper will not be published formal proceedings.
The topics of 10th ICMSSM 2025 cover Mechanical Structures and Smart Materials Related Issue, etc.
Topics of interest for submission include, but are not limited to:
| T1: Smart Materials and Intelligent Systems | ||
|
• Shape memory alloys and polymers • Piezoelectric and magnetostrictive materials • 4D printing in smart structures • Self-healing materials |
• Smart gels and programmable materials • AI-driven intelligent materials • Soft robotics and adaptive structures • Nano-scale smart materials |
• Phase change and thermochromic materials • Energy harvesting smart materials • Adaptive coatings and surfaces • Smart fibers and wearables |
| T2: Manufacturing and Applications of Smart Materials | ||
| • 3D/4D printing of smart materials • High-performance composites • Nanomaterials and metamaterials • MEMS and NEMS devices |
• Biomedical smart materials • Aerospace smart materials • Energy storage materials • Flexible and stretchable electronics |
• Smart catalytic materials • Adaptive materials for infrastructure • Smart polymers in sensors • Superhydrophobic and responsive surfaces |
| T3: Advanced Metallic Materials and Applications | ||
| • High-strength alloy materials • Lightweight metals (Al, Mg, Ti) • Metal matrix composites (MMCs) • 3D/4D printing of metals |
• Superalloys for high temperatures • Corrosion and fatigue studies • Metallic glasses and amorphous alloys • Surface modification of metals |
• High-entropy alloys (HEAs) • Shape memory alloys (SMA) • Smart metals for sensors and actuators • Sustainable and recyclable metals |
| T4: Advanced Mechanical Structures and Design | ||
| • Lightweight structures and optimization • Composite mechanics and manufacturing • Welding, joining, and assembly • Structural analysis and topology optimization |
• Thermo-mechanical-electrical coupling • Dynamics and simulation of mechanical systems • Durability and reliability of structures • Manufacturing effects on structural performance |
• High-performance alloys in structures • Vibration and noise control • Biomechanics and biomimetic design • Energy absorption and impact protection |
| T5: Methodology of Research and Analysis and Modeling | ||
| • Metallographic • Quantitative Metallographic • Computational Material Science • Electron Microscopy • X-ray Phase Analysis • Image Analysis |
• Residual Life Analysis • Mould Flow Analysis • Materials and Engineering Databases • Numerical Techniques • Statistic Methods • Artificial Intelligence Methods |
• Process Systems Design • Expert Systems • Rapid Prototyping • Engineering Design • Technological Design • Materials Design |