Submission method

  • All papers should be submitted using the submission system provided by Openconf system or Email.

    1. Submit by Openconf system: http://icmssm.org/openconf/openconf.php

    2. Email submission: If you can not upload paper or have other problems in using the Openconf system, you can choose to submit by sending email to cfp@icmssm.org.

    Note: Please choose a way to submit, do not repeat delivery

    The conference’s official language is English. All papers must be written in English and must be formatted MS Word according to the following instructions. In addition, all papers should be no less than 5 pages in length and must be written in strict accordance with the format. Shorter papers should not be included in the journal. The minimum number of references should be 5.

    A. Template for Conference Proceeding(Full Length Papers Only) 

    Authors are invited to submit technical papers on their research relevant to the conference theme. Accepted papers will be published in the proceedings of "Materials Science Forum" [ISSN print 0255-5476 ISSN cd 1662-9760 ISSN web 1662-9752, Trans Tech Publications] or “Key Engineering Materials”[ISSN print 1013-9826 ISSN cd 1662-9809 ISSN web 1662-9795, Trans Tech Publications] submitted for inclusion into SCOPUS, Google Scholar, etc. (The proceedings of past ICMSSM conferences have been indexed by SCOPUS, Google Scholar, etc.). Please prepare your paper according to the following template:

    Paper Template

    B. Template for Abstract Proceeding (Abstracts Only) 

    For those who are only interested in attendance and making an oral or poster presentation, Abstracts should be submitted in .DOC format according to the template below:

    Abstract Template 

    Please note that the abstracts submitted for attendance will not be published in any journals. The Conference Abstract Proceedings is for communication purpose only.

    C. Listeners 

    If you want to attend the conference as listener, please contact with cfp@icmssm.org for details.